RF & Wireless Components

Tracks radio component markets and supplier share, and examines new technologies such as RF MEMS, tunable varicaps, metamaterial, advances in fabrication processes, packaging, monolithic integration, and new system and sub-system architectures.

September 1, 2010 17:09 skundojjala

Consolidation in the baseband market continued with Intel acquiring Infineon's wireless business on Monday for $1.4 billion. Infineon's takeover is the fourth high-profile announcement in the last two years. Previously NXP, Freescale and Texas Instruments announced their exits from the merchant baseband market. This signals that the entry barrier is now too high for new entrants and raises pressure on smaller players such as Marvell, Spreadtrum and Icera. Intel's acquisition of Infineon's wireless business leaves Qualcomm, MediaTek, ST-Ericsson, Intel, Broadcom and Renesas as long-term players in the cellular baseband market. We analyzed this back in May when the original rumour of the Intel/Infineon wireless deal surfaced. Infineon's wireless business is definitely an attractive target for Intel as it gives immediate access to valuable IP and an established customer base. Infineon is a rising star in the W-CDMA baseband market and ranked number two in the W-CDMA baseband market behind Qualcomm (excluding Texas Instruments’ custom baseband business with Nokia). Infineon has so far focused on slim modems and has stayed away from developing ARM-based applications processors. So far Infineon’s niche strategy has paid off, but the time has come for the company to expand its portfolio by offering a wider range of processors to address smartphones, tablets and other connected consumer devices. Although 3G and smartphones are of most interest to Intel, the company is likely to keep Infineon’s 2G business as it provides scale which is crucial to play in the cellular baseband segment. It will be another year or two before Intel's applications processors are smartphone-ready. Meanwhile, in the next 12 - 18 months Intel can bundle Infineon's 3G platform with all of its notebook and netbook chipsets and gain significant 3G share to undercut Qualcomm and ST-Ericsson's non-handset offerings. But both Qualcomm and ST-Ericsson appear to have a two year technology lead over Infineon in chipsets for HSPA+ and LTE; Infineon is expected to introduce its first HSPA+ chipset in 2011 and an LTE chipset in 2012. MediaTek’s grey handset chip business may come under pressure from Infineon in the future if Intel expands its field application engineering force in China. Likewise, Broadcom is expected to come under pressure from this deal but should survive with help from its other businesses such as connectivity and digital home. This acquisition will also likely affect stand-alone application processor vendors such as Texas Instruments and NVIDIA that currently lack their own 3G / 4G modems. But we believe that it will take another 4-5 years for Intel to integrate basebands into its Atom CPU, if at all. Infineon's acquisition still doesn’t guarantee Intel's success in the wireless handset market and the company's ultimate success in this market hinges on how soon Intel can come up with power-efficient processors that can stand-up and compete against a host of ARM-based processor vendors. On a positive note, Intel appears to be moving ahead of its other chip competitors in the software area which positions it well against ARM-based processor vendors. The company’s strong software expertise could help it to gain some OEM mindshare. Intel’s uninspiring track record in the wireless market during the last decade suggests that the company has to execute flawlessly this time to make it successful and keep Infineon’s wireless business as independent as possible. Clients can read our eight page analysis of the Intel/Infineon deal here.


November 11, 2009 22:11 ctaylor
Freescale sold off their Tempe, AZ transceiver design team and IP to Fujitsu in April 2009, but the companies kept this relatively quiet until recently. On September 15 '09, Fujitsu announced the MB86L01A, a world-class quad-EDGE quad-WCDMA transceiver from Freescale's Tempe design team. This transceiver has most of the features that Sequoia (now defunct) and SiRiFIC (acquired by Icera) claimed for their leading-edge transceivers: multi-band, internally reconfigurable, eliminates 3G SAW filters, can operate with dual-mode PAs, works in open or closed loop PA control modes, accepts simple commands from the baseband to change modes and bands, DigRF interface. This is a winning product, at least on paper. We expect Fujitsu to initially get attention from Motorola, RIM, and OEMs in Japan with the transceiver, the success of which would quickly help establish Fujitsu as a viable chipset vendor beyond the domestic Japanese market. Chris Taylor Client reading:  Handset Transceivers: Still Crucial to Positioning & Survival of Chipset Leaders

September 23, 2009 16:09 ctaylor
Freescale Semiconductor posted its Q3 ’09 results on July 24 for the quarter ended June 30, 2009. Sales dropped two percent to $824 million sequentially, and 44 percent from $1,472 million in the year-ago quarter. Net income (loss) was ($459) million, or negative 58.7 percent of sales. Much of the decline in sales over the past year appears to have come from the Cellular Products Division, which Freescale put up for sale in early 2008. According to Mitch Haws of Corporate Communications, potential buyers have had their own problems to deal with, and so Freescale will probably continue to support current CPD customers with little or no investment in new products. Freescale’s main cellular chip customers are now RIM and iDEN (i.e. Motorola Plantation), business that should continue for the next few years. According to Mitch, Freescale “took out much of the CPD headcount last April.” This helped the company to reduce expenditures by more than $500 million per quarter over the past several quarters. With Motorola’s share of the cellphone market now around six percent and less than half of Motorola’s chipset needs supplied by Freescale, we believe that Freescale’s chipset sales probably did not exceed $100 million in fiscal Q3 ’09. Freescale continues to do well in RF power devices for infrastructure (mostly LDMOS power transistors), in processors for communications infrastructure, in automotive electronics, and in microcontrollers. However, even with these strengths, it is not clear to us whether Freescale can remain viable much longer. The real kicker will come in 2012, when the company will have to pay off about $550 million in mature debt, followed by $3.25 billion in debt due in 2013 and $3.1 billion due in 2014. Even if the company can increase sales at double digits rates per year and generate a healthy net income of ten percent or more of sales per quarter, making annual payments of more than $400 million would seem a very big challenge. This leads us to believe that the company will go through more product line divestitures and creative financing before coming out from under its current debt burden as a financially viable and stable entity. LBO Debt Load Threatens Freescale's RF Business Chris Taylor